Bharani Technologies stands as a leader in PCB assembly and manufacturing, offering cutting-edge technology and unmatched craftsmanship. We cater to diverse client needs, from quick-turn prototypes to high-volume production, delivering tailored solutions with precision and reliability.
We specialize in a broad range of PCB assembly techniques, including:
With over 3 years of experience, Bharani Technologies has established a reputation for delivering high-quality PCB assemblies compliant with international standards. We use top-grade components and rigorous quality checks at every stage of the assembly process to ensure reliability and performance.
Our PCB assembly solutions support a wide range of industries, including:
At Bharani Technologies, we believe in a personalized approach for every project. From prototype design to mass production, our team works closely with clients to ensure every detail is executed flawlessly.
Bharani Technologies provides standard wire bonding services that is cost-effective and flexible for the vast majority of semiconductor packages. Our standard wire bonding services include gold ball bonding and aluminium wedge bonding
Our services are created to meet all the repair and rework requirements that any client may have including:
Pad and Track Repair: We repair damage on the PCB surface related to SMT pads and tracks. We even fix poor quality work that may have been done on the PCB.
BGA Site Modification: We undertake Site Modification without extensively changing the BGA site. We utilize flat, thin, ribbon jumper wires, which can fit easily under the BGA to achieve this.
Damaged or Missing BGA pads: We utilize industry approved adhesives to allow the BGA to bond with the board.
Component removal and replacement: We utilize air vacuum equipment to remove and replace BGA pads.
